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Inventor profile of:

CHANMI LEE

City:

Daejeon

Country:

South Korea

Published Applications:

11

Last publication date:

2025-09-11

Top Assignees for applications by CHANMI LEE

The entities that hold a legal rights for patent applications filed by inventor LEE CHANMI:

Electronics and Telecommunications Research Institute 8 Daejeon, South Korea

Recent patent applications by LEE CHANMI

CHANMI LEE from Daejeon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-09-11

US20250282908A1

Chemistry; metallurgy

FLUX AGENT AND SEMICONDUCTOR PACKAGE INCLUDING CURED PRODUCT THEREOF

#2 | 2025-05-15

US20250154325A1

Chemistry; metallurgy

VANILLIC ACID-BASED ORGANIC-INORGANIC COMPOUND, CURABLE COMPOSITION, AND PRODUCTION METHOD THEREOF

#3 | 2024-01-18

US20240021570A1

BONDING APPARATUS

#4 | 2023-12-07

US20230391956A1

Chemistry; metallurgy

SILYL ETHER ISOHEXIDE-BASED ORGANIC-INORGANIC COMPOUND, METHOD FOR PREPARING THE SAME, AND CURABLE COMPOSITION CONTAINING THE SAME

#5 | 2023-10-12

US20230326810A1

MICROWAVE HEATING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGING USING THE SAME

#6 | 2023-01-26

US20230027892A1

ELECTRONIC DEVICE AND ITS REPAIR METHOD

#7 | 2022-12-22

US20220402070A1

Performing operations; transporting

LASER CONTROL STRUCTURE AND LASER BONDING METHOD USING THE SAME

#8 | 2022-12-01

US20220384674A1

METHOD OF MANUFACTURING ELECTRIC DEVICE

#9 | 2022-03-31

US20220102603A1

Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials

#10 | 2022-03-10

US20220077099A1

COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISING CURED PRODUCT THEREOF, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

#11 | 2021-12-30

US20210402525A1

Performing operations; transporting

Wire for electric bonding

InventorID:

5280984 ⎘