Eiichiro ISHIMIZU

City:

Funabashi

Country:

Japan

Published Applications:

Last publication date:

2023-12-28

Top Assignees for applications by Eiichiro ISHIMIZU

The entities that hold a legal rights for patent applications filed by inventor ISHIMIZU Eiichiro:

NISSAN CHEMICAL CORPORATION 7 Tokyo, Japan
NISSAN CHEMICAL INDUSTRIES, LTD. 1 Tokyo, Japan

Recent patent applications by ISHIMIZU Eiichiro

Eiichiro ISHIMIZU from Funabashi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-12-28

US20230416569A1

Chemistry; metallurgy

Composition for post-polishing to be used after primary polishing of silicon wafers

#2 | 2023-06-08

US20230178376A1

Electricity

Method for polishing silicon wafer with reduced wear on carrier, and polishing liquid used therein

#3 | 2022-11-10

US20220356373A1

Chemistry; metallurgy

Polishing composition comprising polishing particles having high water affinity

#4 | 2022-07-21

US20220228031A1

Chemistry; metallurgy

POLISHING COMPOSITION USING POLISHING PARTICLES CONTAINING BASIC SUBSTANCE AND HAVING HIGH WATER AFFINITY

#5 | 2022-02-17

US20220049126A1

Chemistry; metallurgy

Cation-containing polishing composition for eliminating protrusions around laser mark

#6 | 2021-12-30

US20210407816A1

Electricity

Method for polishing silicon wafer with reduced wear on carrier, and polishing liquid used therein

#7 | 2020-04-23

US20200123414A1

Chemistry; metallurgy

Polishing composition containing amphoteric surfactant

#8 | 2019-02-21

US20190055131A1

Chemistry; metallurgy

Method for producing purified aqueous solution of silicic acid

InventorID:

5285340 ⎘