Jun Matsui

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-11-20

Top Assignees for applications by Jun Matsui

The entities that hold a legal rights for patent applications filed by inventor Matsui Jun:

MITSUBISHI CHEMICAL CORPORATION 9 Tokyo, Japan

Recent patent applications by Matsui Jun

Jun Matsui from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-20

US20250353993A1

Chemistry; metallurgy

PARTICLE-CONTAINING FIBER BUNDLE PRODUCTION METHOD AND PARTICLE-CONTAINING FIBER BUNDLE

#2 | 2025-11-13

US20250346005A1

Performing operations; transporting

METHOD FOR PRODUCING SHEET PREPREG, METHOD FOR SUPPLYING FIBER RAW MATERIAL, AND SHEET PREPREG

#3 | 2025-07-31

US20250243329A1

Chemistry; metallurgy

RESIN COMPOSITION, METHOD FOR PRODUCING RESIN PRODUCT, AND FLAME RETARDANT MASTERBATCH

#4 | 2025-03-06

US20250073958A1

Performing operations; transporting

METHOD FOR PRODUCING CARBON FIBER BUNDLE COMPOSITE AND METHOD FOR PRODUCING CARBON FIBER BUNDLE COMPOSITE SHEET

#5 | 2024-12-26

US20240426034A1

Textiles; paper

METHOD FOR PRODUCING CARBON FIBER BUNDLE COMPOSITE, AND CARBON FIBER BUNDLE COMPOSITE

#6 | 2024-10-03

US20240326293A1

Performing operations; transporting

Method of Producing Fiber Assembly and Method of Producing Prepreg Sheet

#7 | 2024-03-28

US20240101775A1

Chemistry; metallurgy

Self-Assembled Carbon Fiber Bundle, Method for Producing Same, Prepreg and Method Producing Same

#8 | 2022-09-22

US20220298397A1

Chemistry; metallurgy

LAMINATE, PRODUCTION METHOD THEREFOR, AND AUTOMOTIVE EXTERIOR MATERIAL

#9 | 2022-01-06

US20220002608A1

Chemistry; metallurgy

Thermally Conductive Resin Sheet, Laminated Heat Dissipation Sheet, Heat Dissipation Circuit Board, and Power Semiconductor Device

InventorID:

5289154 ⎘