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Inventor profile of:

Patrick A. van Cleemput

City:

Duvall, Washington

Country:

United States

Published Applications:

Last publication date:

2025-06-05

Top Assignees for applications by Patrick A. van Cleemput

The entities that hold a legal rights for patent applications filed by inventor van Cleemput Patrick A.:

LAM RESEARCH CORPORATION 8 Fremont, CA United States

Recent patent applications by van Cleemput Patrick A.

Patrick A. van Cleemput from Duvall, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-06-05

US20250179635A1

Chemistry; metallurgy

DEPOSITION OF MOLYBDENUM

#2 | 2024-09-05

US20240297075A1

Electricity

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

#3 | 2024-08-15

US20240271281A1

Chemistry; metallurgy

DEPOSITION OF METAL FILMS

#4 | 2024-01-25

US20240030031A1

Electricity

TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING

#5 | 2023-09-14

US20230290680A1

Electricity

SELF-LIMITING GROWTH

#6 | 2023-08-17

US20230260834A1

Electricity

METAL OXIDE DIFFUSION BARRIERS

#7 | 2022-12-08

US20220389579A1

Chemistry; metallurgy

DEPOSITION OF PURE METAL FILMS

#8 | 2022-11-24

US20220375792A1

Electricity

MOLYBDENUM FILL

#9 | 2022-11-10

US20220359211A1

Electricity

Molybdenum deposition

#10 | 2022-11-10

US20220356579A1

Chemistry; metallurgy

DEPOSITION OF METAL FILMS

#11 | 2022-10-13

US20220328317A1

Electricity

MOLYBDENUM DEPOSITION

#12 | 2022-09-15

US20220290300A1

Chemistry; metallurgy

Metal deposition

#13 | 2022-07-14

US20220223471A1

Electricity

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

#14 | 2022-01-06

US20220005694A1

Electricity

Tin oxide thin film spacers in semiconductor device manufacturing

InventorID:

5291758 ⎘