Daisuke Chino

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2016-08-25

Top Assignees for applications by Daisuke Chino

The entities that hold a legal rights for patent applications filed by inventor Chino Daisuke:

Daisuke Chino from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Method and device for cutting out hard-brittle substrate

Method and device for cutting out hard-brittle substrate and protecting regions on the substrate

InventorID:

529470 ⎘