Mate Jenei

City:

Espoo

Country:

Finland

Published Applications:

Last publication date:

2024-02-29

Top Assignees for applications by Mate Jenei

The entities that hold a legal rights for patent applications filed by inventor Jenei Mate:

Mate Jenei from Espoo, FI has applied for patents for these inventions. The list has both pending applications and granted patents:

Chip fabrication method and product including raised and recessed alignment structures

Electroplating for vertical interconnections

SUPERCONDUCTING THROUGH SUBSTRATE VIAS

Three-dimensional superconducting qubit and a method for manufacturing the same

QUANTUM COMPUTING CIRCUIT COMPRISING A PLURALITY OF CHIPS AND METHOD FOR MANUFACTURING THE SAME

InventorID:

5297339 ⎘