Brian SPRINGER

City:

Springfield, Michigan

Country:

United States

Published Applications:

Last publication date:

2025-09-25

Recent patent applications by SPRINGER Brian

Brian SPRINGER from Springfield, US has applied for patents for these inventions. The list has both pending applications and granted patents:

ALUMINUM ALLOYS FOR STRUCTURAL HIGH PRESSURE VACUUM DIE CASTING APPLICATIONS

METHOD OF MANUFACTURING A BLENDED MATERIAL INCLUDING ALUMINUM ALLOYS FOR STRUCTURAL HIGH PRESSURE VACUUM DIE CASTING APPLICATIONS

ALUMINUM ALLOYS FOR STRUCTURAL HIGH PRESSURE VACUUM DIE CASTING APPLICATIONS

InventorID:

5301655 ⎘