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Inventor profile of:

Richard Wacker

City:

Hanau

Country:

Germany

Published Applications:

Last publication date:

2026-06-04

Top Assignees for applications by Richard Wacker

The entities that hold a legal rights for patent applications filed by inventor Wacker Richard:

HERAEUS DEUTSCHLAND GMBH & CO. KG 1 Hanau, Germany

Recent patent applications by Wacker Richard

Richard Wacker from Hanau, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-06-04

US20260157178A1

Electricity

METAL-CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT COMPRISING A METAL-CERAMIC SUBSTRATE

#2 | 2026-01-29

US20260033336A1

Electricity

METAL-CERAMIC SUBSTRATE WITH CONTACT AREA

#3 | 2026-01-22

US20260022076A1

Chemistry; metallurgy

METAL-CERAMIC SUBSTRATE WITH CONTACT AREA

#4 | 2025-07-24

US20250240884A1

Electricity

METAL-CERAMIC SUBSTRATE WITH CONTACT AREA

#5 | 2025-06-05

US20250183116A1

Electricity

METAL-CERAMIC COMPOSITE

#6 | 2025-06-05

US20250178980A1

Chemistry; metallurgy

METHOD FOR STRUCTURING A METAL-CERAMIC COMPOSITE

#7 | 2025-06-05

US20250178979A1

Chemistry; metallurgy

METAL-CERAMIC COMPOSITE

#8 | 2025-06-05

US20250178978A1

Chemistry; metallurgy

METAL-CERAMIC COMPOSITE

#9 | 2024-02-29

US20240074064A1

Electricity

METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED METAL CERAMIC SUBSTRATE

#10 | 2022-12-29

US20220411339A1

Chemistry; metallurgy

METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE AND FURNACE

#11 | 2022-12-29

US20220410299A1

Performing operations; transporting

Method for producing a metal-ceramic substrate

#12 | 2022-02-03

US20220037179A1

Electricity

PACKAGING UNIT FOR SUBSTRATES

#13 | 2022-01-20

US20220022336A1

Electricity

PACKAGING UNIT FOR A SUBSTRATE

InventorID:

5305106 ⎘