Suwon
South Korea
8
2026-05-21
The entities that hold a legal rights for patent applications filed by inventor CHO Hyunchul:
Hyunchul CHO from Suwon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
FINER VIA PITCH FOR THICKER CORE SUBSTRATE
#2 | 2025-07-10HYBRID SUBSTRATE WITH EMBEDDED COMPONENT
#3 | 2024-10-10HYBRID CORE SUBSTRATE WITH EMBEDDED COMPONENTS
#4 | 2023-09-07Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methods
#5 | 2023-03-23Package comprising a substrate with high density interconnects
#6 | 2023-03-16Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the same
#7 | 2023-01-19PACKAGE SUBSTRATE EMPLOYING INTEGRATED SLOT-SHAPED ANTENNA(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
#8 | 2022-02-17Package with substrate comprising variable thickness solder resist layer
5329504 ⎘