Tomoko NOGUCHI

City:

Beppu

Country:

Japan

Published Applications:

Last publication date:

2024-06-27

Top Assignees for applications by Tomoko NOGUCHI

The entities that hold a legal rights for patent applications filed by inventor NOGUCHI Tomoko:

Tomoko NOGUCHI from Beppu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS

Semiconductor device having tapered metal coated sidewalls

TRANSFORMERS WITH SEPARATED MAGNETIC MEMBERS

Bump bond structure for enhanced electromigration performance

Bump bond structure for enhanced electromigration performance

InventorID:

5341917 ⎘