Mamoru Sunada

City:

Kyoto

Country:

Japan

Published Applications:

Last publication date:

2026-01-29

Top Assignees for applications by Mamoru Sunada

The entities that hold a legal rights for patent applications filed by inventor Sunada Mamoru:

Mamoru Sunada from Kyoto, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

MOLDING DIE, RESIN MOLDING APPARATUS, AND METHOD FOR PRODUCING RESIN MOLDED PRODUCT

RESIN MOLDING APPARATUS AND METHOD FOR PRODUCING RESIN MOLDED PRODUCT

Hollow package and method for manufacturing same

InventorID:

5342074 ⎘