William F. SMITH

City:

Windsor, Connecticut

Country:

United States

Published Applications:

Last publication date:

2022-03-10

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The entities that hold a legal rights for patent applications filed by inventor SMITH William F.:

William F. SMITH from Windsor, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Methods of manufacturing a gas diffusion layer and an electrochemical cell incorporating the same

InventorID:

5348611 ⎘