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Inventor profile of:

Hongjun DU

City:

Beijing

Country:

China

Published Applications:

8

Last publication date:

2026-06-11

Top Assignees for applications by Hongjun DU

The entities that hold a legal rights for patent applications filed by inventor DU Hongjun:

  • BOE TECHNOLOGY GROUP CO., LTD. 5 Beijing, China

Recent patent applications by DU Hongjun

Hongjun DU from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-06-11
US20260161458A1
Physics

DATA PROCESSING METHOD, APPARATUS AND SYSTEM

#2 | 2025-11-13
US20250348472A1
Physics

ACCOUNT CREATION METHOD, INTERNET OF THINGS MULTI-TENANT SYSTEM, DEVICE, PROGRAM, AND MEDIUM

#3 | 2025-08-21
US20250267012A1
Electricity

PROCESSOR, SYSTEM AND METHOD FOR INFORMATION AUTHENTICATION

#4 | 2025-04-24
US20250133069A1
Electricity

DEVICE ACCESS METHOD AND SYSTEM AND NON-VOLATILE COMPUTER STORAGE MEDIUM

#5 | 2025-01-02
US20250007889A1
Electricity

INTERNET OF THINGS SYSTEM, AUTHENTICATION AND COMMUNICATION METHOD THEREFOR, AND RELATED DEVICE

#6 | 2024-02-29
US20240073028A1
Electricity

ANTI-COUNTERFEITING VERIFYING METHOD, HARDWARE APPARATUS, SYSTEM, ELECTRONIC DEVICE, AND STORAGE MEDIUM

#7 | 2022-04-28
US20220131942A1
Electricity

Method and system for transmitting data, gateway device, and operating terminal device

#8 | 2022-03-17
US20220083326A1
Physics

Upgrading method and system, server, and terminal device

InventorID:

5352968 ⎘

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