Ryuta ABE

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2024-06-06

Top Assignees for applications by Ryuta ABE

The entities that hold a legal rights for patent applications filed by inventor ABE Ryuta:

Panasonic Holdings Corporation 5 Osaka, Japan
Panasonic Intellectual Property Management Co., Ltd. 2 Osaka, Japan
TOYOTA JIDOSHA KABUSHIKI KAISHA 1 Aichi-ken, Japan

Recent patent applications by ABE Ryuta

Ryuta ABE from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-06-06

US20240181664A1

Performing operations; transporting

CUTTING DEVICE AND CUTTING METHOD

#2 | 2024-05-30

US20240178405A1

Electricity

MACHINING APPARATUS FOR ELECTRODE PLATE AND MACHINING METHOD

#3 | 2024-05-09

US20240149484A1

Performing operations; transporting

CUTTING DEVICE AND CUTTING METHOD

#4 | 2023-12-21

US20230406649A1

Performing operations; transporting

Workpiece conveyance device

#5 | 2023-11-16

US20230364898A1

Performing operations; transporting

Laminating device

#6 | 2023-11-02

US20230352797A1

Electricity

SEPARATOR CUTTING DEVICE AND SEPARATOR CUTTING METHOD

#7 | 2023-08-31

US20230271410A1

Performing operations; transporting

LAMINATING DEVICE

#8 | 2023-03-09

US20230075603A1

Physics

Inspection device, method for producing multilayer electrode body and inspection method

#9 | 2022-03-17

US20220085418A1

Electricity

Sheet material conveyance device

InventorID:

5354539 ⎘