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Inventor profile of:

BongJun Lee

City:

Cascadia

Country:

Singapore

Published Applications:

1

Last publication date:

2022-03-17

Top Assignees for applications by BongJun Lee

The entities that hold a legal rights for patent applications filed by inventor Lee BongJun:

DELL PRODUCTS L.P. 1 Round Rock, TX United States

Recent patent applications by Lee BongJun

BongJun Lee from Cascadia, SG has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-03-17

US20220087038A1

Imprinted emboss in chip-on-film

InventorID:

5355463 ⎘