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Inventor profile of:

Anthony E. Yap

City:

Palmyra, Pennsylvania

Country:

United States

Published Applications:

9

Last publication date:

2026-02-12

Top Assignees for applications by Anthony E. Yap

The entities that hold a legal rights for patent applications filed by inventor Yap Anthony E.:

  • DMT Solutions Global Corporation 4 Danbury, CT United States

Recent patent applications by Yap Anthony E.

Anthony E. Yap from Palmyra, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-02-12
US20260042314A1
Performing operations; transporting

INTEGRATED ENVELOPE SEALER AND FLIP MODULE

#2 | 2025-10-30
US20250332859A1
Performing operations; transporting

HYBRID INSERTER/WRAPPER SYSTEM

#3 | 2025-09-11
US20250282516A1
Performing operations; transporting

SYSTEMS AND METHODS FOR PRINTING AND APPLYING LABELS

#4 | 2025-05-29
US20250174068A1
Physics

CARD PROCESSING AND ATTACHING SYSTEM

#5 | 2024-08-22
US20240279017A1
Performing operations; transporting

AUTOMATED TRAYING OF FINISHED MAIL

#6 | 2024-06-06
US20240181800A1
Performing operations; transporting

INTEGRATED ENVELOPE SEALER AND FLIP MODULE

#7 | 2024-03-21
US20240092118A1
Performing operations; transporting

HYBRID INSERTER/WRAPPER SYSTEM

#8 | 2023-05-18
US20230154269A1
Physics

Card processing and attaching system

#9 | 2022-03-31
US20220097442A1
Performing operations; transporting

Integrated envelope sealer and flip module

InventorID:

5363937 ⎘

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