Tokyo
Japan
11
2025-02-20
The entities that hold a legal rights for patent applications filed by inventor MASUDA Yusuke:
Yusuke MASUDA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Information Processing Device, Information Processing Method, And Program
#2 | 2025-01-02LCP EXTRUDED FILM, INSULATING MATERIAL FOR CIRCUIT BOARD, AND METAL FOIL-CLAD LAMINATE
#3 | 2024-03-14REPRODUCTION SYSTEM, DISPLAY APPARATUS, AND REPRODUCTION APPARATUS
#4 | 2024-02-08LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUDED FILM FOR STRETCH TREATMENT, LCP STRETCHED FILM, HEAT-SHRINKABLE LCP STRETCHED FILM, INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METAL FOIL-CLAD LAMINATE
#5 | 2024-01-25LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUDED FILM FOR STRETCH TREATMENT, LCP STRETCHED FILM, HEAT-SHRINKABLE LCP STRETCHED FILM, INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METAL FOIL-CLAD LAMINATE
#6 | 2024-01-25LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUDED FILM FOR STRETCH TREATMENT, LCP STRETCHED FILM, HEAT-SHRINKABLE LCP STRETCHED FILM, INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METAL FOIL-CLAD LAMINATE
#7 | 2023-11-16INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME, AND METAL FOIL-CLAD LAMINATE
#8 | 2023-11-16INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METAL FOIL-CLAD LAMINATE
#9 | 2022-12-29METHOD FOR MANUFACTURING LCP FILM FOR CIRCUIT SUBSTRATE AND T-DIE MELT-EXTRUDED LCP FILM FOR CIRCUIT SUBSTRATE
#10 | 2022-08-11LCP EXTRUDED FILM, AND FLEXIBLE LAMINATE USING THE SAME AND MANUFACTURING METHOD THEREOF
#11 | 2022-04-07DOUBLE-SIDED METAL-CLAD LAMINATE AND PRODUCTION METHOD THEREFOR, INSULATING FILM, AND ELECTRONIC CIRCUIT BASE BOARD
5370430 ⎘