Munich
Germany
11
2024-09-05
The entities that hold a legal rights for patent applications filed by inventor Bagung Detlev:
Detlev Bagung from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR COMPONENT ARRANGEMENT, METHOD FOR FABRICATION THEREOF AND HEAT DISSIPATION DEVICE
#2 | 2024-08-01CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR MODULE, AND METHOD FOR PRODUCING A CIRCUIT BOARD AND A POWER SEMICONDUCTOR MODULE
#3 | 2024-03-21Power semiconductor component and method for producing a power semiconductor component
#4 | 2022-12-15Device
#5 | 2022-11-17CONTACT ASSEMBLY FOR AN ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
#6 | 2022-10-13Power semiconductor component and method for producing a power semiconductor component
#7 | 2022-04-14Semiconductor component arrangement, method for fabrication thereof and heat dissipation device
#8 | 2021-09-16Charging device module for installation in an electrically driveable vehicle, vehicle and method for cooling components of an electrically driveable vehicle
#9 | 2021-07-01Semiconductor assembly
#10 | 2020-09-10Electrical component and method for the production thereof
#11 | 2020-08-13Printed circuit board and method for processing a printed circuit board
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