Peng Su

City:

Sunnyvale, California

Country:

United States

Published Applications:

Last publication date:

2022-05-03

Top Assignees for applications by Peng Su

The entities that hold a legal rights for patent applications filed by inventor Su Peng:

Peng Su from Sunnyvale, US has applied for patents for these inventions. The list has both pending applications and granted patents:

System and method for attaching an integrated circuit package to a printed circuit board with solder balls having a coined surface profile

Apparatus, system, and method for utilizing package stiffeners to attach cable assemblies to integrated circuits

Apparatus, system, and method for facilitating electrical continuity between sockets and warped electrical components

InventorID:

5378222 ⎘