Inventor profile of:

John C. Moore

City:

Camarillo, California

Country:

United States

Published Applications:

13

Last publication date:

2013-11-21

Top Assignees for applications by John C. Moore

The entities that hold a legal rights for patent applications filed by inventor Moore John C.:

Recent patent applications by Moore John C.

John C. Moore from Camarillo, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-11-21
US20130309471A1
Chemistry; metallurgy

Polybenzimidazole/polyvinylbutyral mixtures

#2 | 2012-06-21
US20120156500A1
Chemistry; metallurgy

PBI/epoxy coatings

#3 | 2011-06-02
US20110129601A1
Chemistry; metallurgy

Polybenzimidazole/polyacrylate mixtures

#4 | 2008-12-11
US20080306207A1
Chemistry; metallurgy

Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive

#5 | 2007-08-16
US20070191243A1
Physics

REMOVAL OF SILICA BASED ETCH RESIDUE USING AQUEOUS CHEMISTRY

#6 | 2007-08-09
US20070185310A1
Chemistry; metallurgy

Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive

#7 | 2007-04-26
US20070093061A1
Electricity

SOLVENT REMOVAL OF PHOTORESIST MASK AND GOLD IMPREGNATED RESIDUE AND PROCESS

#8 | 2006-11-09
US20060252231A1
Electricity

High temperature and chemical resistant process for wafer thinning and backside processing

#9 | 2006-03-02
US20060043070A1
Electricity

High temperature functioning stripper for cured difficult to remove photoresist coatings

#10 | 2005-09-01
US20050192194A1
Chemistry; metallurgy

Dissolving gel for cured polysulfide resins

#11 | 2005-06-23
US20050137103A1
Chemistry; metallurgy

Stripper for cured negative-tone isoprene-based photoresist and bisbenzocyclobutene coatings

#12 | 2005-03-22
US10325389
-

Spin-on adhesive for temporary wafer coating and mounting to support wafer thinning and backside processing

#13 | 2005-01-13
US20050009366A1
Chemistry; metallurgy

Adhesive support method for wafer coating, thinning and backside processing

InventorID:

538404 ⎘