Osaka
Japan
12
2022-06-23
The entities that hold a legal rights for patent applications filed by inventor Kitagawa Daisuke:
Daisuke Kitagawa from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Ventilation assembly and ventilation housing
#2 | 2021-12-16VENTILATION ASSEMBLY AND VENTILATION HOUSING
#3 | 2021-11-18Ventilation housing
#4 | 2021-11-04Ventilation housing
#5 | 2016-07-28Method for producing filler-containing fluororesin sheet
#6 | 2014-09-11Thermally-conductive sheet, LED mounting substrate, and LED module
#7 | 2014-09-11HEAT-DISSIPATING MEMBER AND METHOD FOR PRODUCING SAME
#8 | 2013-11-28HEAT DISSIPATING MEMBER AND METHOD FOR PRODUCING THE SAME
#9 | 2013-11-21HEAT-CONDUCTIVE FILM AND PRODUCTION METHOD THEREFOR
#10 | 2012-09-13LED mounting substrate
#11 | 2011-09-15METHOD OF PRODUCING ELECTRICALLY INSULATING THERMALLY CONDUCTIVE SHEET, ELECTRICALLY INSULATING THERMALLY CONDUCTIVE SHEET, AND HEAT DISSIPATING MEMBER
#12 | 2010-08-12Method for producing polytetrafluoroethylene fiber and polytetrafluoroethylene fiber
538430 ⎘