Inventor profile of:

Wei-Cheng Wang

City:

Hsinchu

Country:

Taiwan

Published Applications:

19

Last publication date:

2025-11-27

Top Assignees for applications by Wei-Cheng Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Wei-Cheng:

Recent patent applications by Wang Wei-Cheng

Wei-Cheng Wang from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-27
US20250366114A1
Electricity

METAL CAPS FOR GATE STRUCTURES

#2 | 2025-11-13
US20250349723A1
Electricity

FORMING SILICON-CONTAINING MATERIAL OVER METAL GATE TO REDUCE LOADING BETWEEN LONG CHANNEL AND SHORT CHANNEL TRANSISTORS

#3 | 2025-10-30
US20250338587A1
Electricity

METHOD OF FORMING METAL GATE FIN ELECTRODE STRUCTURE BY ETCHING BACK METAL FILL

#4 | 2025-10-02
US20250311307A1
Electricity

FORMING LOW-RESISTANCE CAPPING LAYER OVER METAL GATE ELECTRODE

#5 | 2024-11-14
US20240379810A1
Electricity

GATE STRUCTURE FOR SEMICONDUCTOR DEVICE

#6 | 2024-11-14
US20240379796A1
Electricity

Forming Low-Resistance Capping Layer Over Metal Gate Electrode

#7 | 2023-10-05
US20230317799A1
Electricity

GATE STRUCTURES FOR MULTI-GATE DEVICES

#8 | 2023-08-31
US20230276329A1
Electricity

Multi-access edge computing (MEC) system, MEC device, user equipment and user plane function (UPF) switch method

#9 | 2023-07-06
US20230215929A1
Electricity

Metal gate cap

#10 | 2023-05-18
US20230155002A1
Electricity

Method of forming metal gate fin electrode structure by etching back metal fill

#11 | 2023-05-11
US20230140968A1
Electricity

Semiconductor device and method

#12 | 2023-01-26
US20230028460A1
Electricity

Forming Silicon-Containing Material Over Metal Gate To Reduce Loading Between Long Channel And Short Channel Transistors

#13 | 2023-01-12
US20230010952A1
Electricity

Forming Low-Resistance Capping Layer Over Metal Gate Electrode

#14 | 2023-01-12
US20230010065A1
Electricity

METAL CAPS FOR GATE STRUCTURES

#15 | 2022-09-08
US20220285514A1
Electricity

Forming low-resistance capping layer over metal gate electrode

#16 | 2022-09-01
US20220278218A1
Electricity

Metal gate cap

#17 | 2022-04-21
US20220123124A1
Electricity

Semiconductor device and method

#18 | 2020-09-08
US16714200
Electricity

Network communication control method of multiple edge clouds and edge computing system

#19 | 2019-10-24
US20190327275A1
Electricity

Communication system and communication method

InventorID:

5384680 ⎘