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Inventor profile of:

Kensuke IKEUCHI

City:

Osaka

Country:

Japan

Published Applications:

1

Last publication date:

2022-05-05

Recent patent applications by IKEUCHI Kensuke

Kensuke IKEUCHI from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-05-05

US20220135265A1

Performing operations; transporting

FILM THERMOFORMING DEVICE OF BLISTER PACKAGING MACHINE

InventorID:

5393863 ⎘