Ryu Takeda

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2022-09-08

Top Assignees for applications by Ryu Takeda

The entities that hold a legal rights for patent applications filed by inventor Takeda Ryu:

HONDA MOTOR CO., LTD. 2 Tokyo, Japan
Osaka University 1 Suita, Japan
OSAKA UNIVERSITY 1 Osaka, Japan

Recent patent applications by Takeda Ryu

Ryu Takeda from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-09-08

US20220286775A1

Electricity

Acoustic processing device including spatial normalization, mask function estimation, and mask processing, and associated acoustic processing method and storage medium

#2 | 2022-05-05

US20220138578A1

Physics

NODE PRUNING DEVICE, NODE PRUNING METHOD, AND STORAGE MEDIUM

InventorID:

5396724 ⎘