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Inventor profile of:

JunHo Ye

City:

Seoul

Country:

South Korea

Published Applications:

6

Last publication date:

2024-05-09

Top Assignees for applications by JunHo Ye

The entities that hold a legal rights for patent applications filed by inventor Ye JunHo:

  • STATS ChipPAC Pte Ltd. 6 Singapore, Singapore

Recent patent applications by Ye JunHo

JunHo Ye from Seoul, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-05-09
US20240153783A1
Electricity

Double-Sided Partial Molded SiP Module

#2 | 2024-04-18
US20240128201A1
Electricity

Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation

#3 | 2023-10-26
US20230343732A1
Electricity

Semiconductor device and method of forming discrete antenna modules

#4 | 2023-03-16
US20230081706A1
Electricity

Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation

#5 | 2023-03-09
US20230074430A1
Electricity

Double-sided partial molded SIP module

#6 | 2022-05-12
US20220148983A1
Electricity

Semiconductor device and method of forming discrete antenna modules

InventorID:

5405488 ⎘

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