Seung-Jun Lee

City:

Suwon

Country:

South Korea

Published Applications:

Last publication date:

2022-06-09

Top Assignees for applications by Seung-Jun Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Seung-Jun:

Hewlett-Packard Development Company, L.P. 1 Spring, TX United States

Recent patent applications by Lee Seung-Jun

Seung-Jun Lee from Suwon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-06-09

US20220179344A1

Physics

Belt comprising coating layer comprising inorganic-organic nanocomposite materials, and fusing apparatus and gloss-enhancing apparatus comprising the same

InventorID:

5429513 ⎘