Daisuke NII

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2022-06-16

Top Assignees for applications by Daisuke NII

The entities that hold a legal rights for patent applications filed by inventor NII Daisuke:

Daisuke NII from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board

InventorID:

5434635 ⎘