Ryosuke YANAKA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-09-26

Top Assignees for applications by Ryosuke YANAKA

The entities that hold a legal rights for patent applications filed by inventor YANAKA Ryosuke:

Ryosuke YANAKA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

ELECTRONIC ARTICLE PACKAGING SHEET

RESIN SHEET FOR PACKAGING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT PACKAGING CONTAINER USING SAME

SHEET FOR PACKAGING ELECTRONIC PART

Layered sheet, container, carrier tape, and electronic component packaging body

Layered sheet, electronic component packaging container, and electronic component packaging

InventorID:

5441109 ⎘