Logan Jae HWANG

City:

Country:

United States

Published Applications:

Last publication date:

2022-06-30

Recent patent applications by HWANG Logan Jae

Logan Jae HWANG from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

Contact pin for testing semiconductor IC for high speed signal, spring contact including same, and socket device

Contact and socket device for burning-in and testing semiconductor IC

InventorID:

5443773 ⎘