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Inventor profile of:

Daniel RENDELL

City:

Abingdon

Country:

Great Britain (UK)

Published Applications:

2

Last publication date:

2024-09-26

Recent patent applications by RENDELL Daniel

Daniel RENDELL from Abingdon, GB has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-09-26

US20240324152A1

Cooling Apparatus

#2 | 2022-06-23

US20220199492A1

SEMICONDUCTOR COOLING ARRANGEMENT WITH IMPROVED BAFFLE

InventorID:

5445985 ⎘