Bucheon
South Korea
5
2024-03-14
The entities that hold a legal rights for patent applications filed by inventor BAEK Jonghwan:
Jonghwan BAEK from Bucheon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
#2 | 2023-08-10Dual cool power module with stress buffer layer
#3 | 2023-08-03Power module and related methods
#4 | 2022-06-30Power module and related methods
#5 | 2022-06-23Dual cool power module with stress buffer layer
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