BOON SENG TEOH

City:

BAYAN LEPAS

Country:

Malaysia

Published Applications:

Last publication date:

2024-02-01

Top Assignees for applications by BOON SENG TEOH

The entities that hold a legal rights for patent applications filed by inventor TEOH BOON SENG:

BOON SENG TEOH from BAYAN LEPAS, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

A METHOD FOR FABRICATING SEMICONDUCTOR ARTICLES AND SYSTEM THEREOF

METHOD FOR PRINTING SOLDER ONTO A WAFER AND SYSTEM THEREOF

InventorID:

5459288 ⎘