Daisuke IWATA

City:

Inuyama

Country:

Japan

Published Applications:

Last publication date:

2025-02-27

Top Assignees for applications by Daisuke IWATA

The entities that hold a legal rights for patent applications filed by inventor IWATA Daisuke:

Daisuke IWATA from Inuyama, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

PACKAGING MATERIAL

LAMINATED FILM AND PACKAGING MATERIAL

LAMINATED BODY

LAMINATED FILM AND PACKAGING MATERIAL

LAMINATED FILM AND PACKAGING MATERIAL

LAMINATED FILM AND PACKAGING MATERIAL

TRANSPARENT GAS BARRIER FILM AND METHOD FOR PRODUCING SAME

InventorID:

5462662 ⎘