Jun ARIKAWA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-11-27

Top Assignees for applications by Jun ARIKAWA

The entities that hold a legal rights for patent applications filed by inventor ARIKAWA Jun:

Jun ARIKAWA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

CERAMIC JOINED BODY, ELECTROSTATIC CHUCK DEVICE, AND METHOD FOR MANUFACTURING CERAMIC JOINED BODY

CERAMIC ASSEMBLY AND ELECTROSTATIC CHUCK DEVICE

CERAMIC JOINED BODY, ELECTROSTATIC CHUCKING DEVICE, AND METHOD FOR PRODUCING CERAMIC JOINED BODY

CERAMIC JOINED BODY, ELECTROSTATIC CHUCK DEVICE, AND METHOD FOR PRODUCING CERAMIC JOINED BODY

CERAMIC JOINED BODY, ELECTROSTATIC CHUCK DEVICE, AND METHOD FOR PRODUCING CERAMIC JOINED BODY

Composite sintered body, electrostatic chuck member, electrostatic chuck device, and method for manufacturing composite sintered body

InventorID:

5464966 ⎘