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Inventor profile of:

Dengming LEI

City:

Shanghai

Country:

China

Published Applications:

5

Last publication date:

2024-05-23

Top Assignees for applications by Dengming LEI

The entities that hold a legal rights for patent applications filed by inventor LEI Dengming:

Shanghai Tianma Micro-Electronics Co., Ltd. 4 Shanghai, China
Shanghai Tianma Microelectronics Co., Ltd. 2 SHANGHAI, China

Recent patent applications by LEI Dengming

Dengming LEI from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-05-23

US20240165616A1

Performing operations; transporting

MICROFLUIDIC CHIP

#2 | 2023-05-04

US20230138258A1

Scanning antenna

#3 | 2022-09-08

US20220285843A1

Antenna and preparation method thereof, phase shifter and communication device

#4 | 2022-09-08

US20220285807A1

Antenna including at least one microstrip line phase shifting unit having a photo-dielectric layer and a light guiding structure configured to guide light into the photo-dielectric layer

#5 | 2022-07-14

US20220224006A1

ANTENNA DEVICE

InventorID:

5465327 ⎘