Daniel Douriet

Fabrication method for circuit substrate having post-fed die side power supply connections

Fabrication method for circuit substrate having post-fed die side power supply connections

Circuit substrate having post-fed die side power supply connections

Method and apparatus for facilitating signal transmission using differential transmission lines

Method for detecting noise events in systems with time variable operating points

Design method and system for minimizing blind via current loops

Power delivery analysis and design

Analyzing Impedance Discontinuities In A Printed Circuit Board

Enhancing a power distribution system in a ceramic integrated circuit package

Method for detecting noise events in systems with time variable operating points

Mitigate power supply noise response by throttling execution units based upon voltage sensing

System DC Analysis Methodology

Method and computer program product for designing power distribution system in a circuit

Apparatus and method for selectively monitoring multiple voltages in an IC or other electronic chip

Fabricating substrates having low inductance via arrangements

Method, apparatus, and computer program product for enhancing a power distribution system in a ceramic integrated circuit package

Connector with conductors exposed to exterior air to facilitate heat removal

Method, apparatus and computer program product for implementing enhanced high frequency return current paths utilizing decoupling capacitors in a package design

Method, structure, and computer program product for implementing high frequency return current paths within electronic packages