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Inventor profile of:

Ke Dai

City:

Hefei

Country:

China

Published Applications:

1

Last publication date:

2022-08-11

Recent patent applications by Dai Ke

Ke Dai from Hefei, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-08-11

US20220254561A1

TRANSFORMER AND PACKAGE MODULE

InventorID:

5489943 ⎘