Wei LI

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2024-11-21

Top Assignees for applications by Wei LI

The entities that hold a legal rights for patent applications filed by inventor LI Wei:

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 4 HSINCHU, Taiwan
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 3 Hsinchu, Taiwan
TSMC CHINA COMPANY LIMITED 2 Shanghai, China
TSMC CHINA COMPANY, LIMITED 1 Songjiang, China

Recent patent applications by LI Wei

Wei LI from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-11-21

US20240387508A1

Electricity

METHOD OF OPERATING CIRCUIT, AND SEMICONDUCTOR DEVICE

#2 | 2023-10-26

US20230344346A1

Electricity

DUAL MODE SUPPLY CIRCUIT AND METHOD

#3 | 2023-06-08

US20230172561A1

Human necessities

MONITORING DEVICE FOR PHYSIOLOGICAL SIGNAL MONITORING AND OPERATION METHOD THEREOF

#4 | 2023-03-23

US20230092315A1

Electricity

Semiconductor circuit including a tie-low circuit and method of fabricating same

#5 | 2023-03-16

US20230083606A1

Electricity

Dual mode supply circuit and method

#6 | 2022-08-11

US20220255426A1

Electricity

Dual mode supply circuit and method

#7 | 2011-12-22

US20110309357A1

Physics

Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor

#8 | 2011-05-12

US20110108973A1

Electricity

Chip package structure and method for fabricating the same

#9 | 2009-12-03

US20090294947A1

Electricity

Chip package structure and manufacturing method thereof

InventorID:

5490525 ⎘