Robert Ploessl

City:

Ithaca, New York

Country:

United States

Published Applications:

Last publication date:

2022-08-25

Top Assignees for applications by Robert Ploessl

The entities that hold a legal rights for patent applications filed by inventor Ploessl Robert:

Robert Ploessl from Ithaca, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Thermally decomposing build plate with casting mold for facile release of 3D printed objects

Metal chemical polishing process for minimizing dishing during semiconductor wafer fabrication

InventorID:

5498638 ⎘