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Inventor profile of:

Lei Hu

City:

Siegen

Country:

Germany

Published Applications:

1

Last publication date:

2022-09-01

Recent patent applications by Hu Lei

Lei Hu from Siegen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-09-01

US20220275490A1

Chemistry; metallurgy

Spring Wire, Tension Clamp Formed Therefrom and Method for Manufacturing Such a Spring Wire

InventorID:

5506233 ⎘