Inventor profile of:

Rachel E. BATZER

City:

Tigard, Oregon

Country:

United States

Published Applications:

15

Last publication date:

2026-02-12

Top Assignees for applications by Rachel E. BATZER

The entities that hold a legal rights for patent applications filed by inventor BATZER Rachel E.:

Recent patent applications by BATZER Rachel E.

Rachel E. BATZER from Tigard, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-02-12
US20260043135A1
Chemistry; metallurgy

INDEPENDENTLY ADJUSTABLE FLOWPATH CONDUCTANCE IN MULTI-STATION SEMICONDUCTOR PROCESSING

#2 | 2025-07-10
US20250226227A1
Electricity

DEPOSITION OF METAL-CONTAINING FILMS AND CHAMBER CLEAN

#3 | 2025-04-24
US20250132127A1
Electricity

TRANSFORMER COUPLED PLASMA SOURCE DESIGN FOR THIN DIELECTRIC FILM DEPOSITION

#4 | 2025-01-16
US20250022696A1
Electricity

APPARATUSES AND TECHNIQUES FOR CLEANING A MULTI-STATION SEMICONDUCTOR PROCESSING CHAMBER

#5 | 2025-01-02
US20250006514A1
Electricity

APPARATUSES FOR CLEANING A MULTI-STATION SEMICONDUCTOR PROCESSING CHAMBER

#6 | 2025-01-02
US20250003074A1
Chemistry; metallurgy

INTEGRATED SHOWERHEAD WITH IMPROVED HOLE PATTERN FOR DELIVERING RADICAL AND PRECURSOR GAS TO A DOWNSTREAM CHAMBER TO ENABLE REMOTE PLASMA FILM DEPOSITION

#7 | 2024-12-12
US20240412953A1
Electricity

APPARATUSES AND SYSTEMS FOR AMMONIA/CHLORINE CHEMISTRY SEMICONDUCTOR PROCESSING

#8 | 2024-09-26
US20240318312A1
Chemistry; metallurgy

INTEGRATED SHOWERHEAD WITH THERMAL CONTROL FOR DELIVERING RADICAL AND PRECURSOR GAS TO A DOWNSTREAM CHAMBER TO ENABLE REMOTE PLASMA FILM DEPOSITION

#9 | 2024-07-04
US20240218509A1
Chemistry; metallurgy

MINIMIZING RADICAL RECOMBINATION USING ALD SILICON OXIDE SURFACE COATING WITH INTERMITTENT RESTORATION PLASMA

#10 | 2023-11-23
US20230374661A1
Chemistry; metallurgy

SHOWERHEAD WITH INTEGRAL DIVERT FLOW PATH

#11 | 2023-10-19
US20230332291A1
Chemistry; metallurgy

REMOTE PLASMA ARCHITECTURE FOR TRUE RADICAL PROCESSING

#12 | 2023-09-28
US20230304156A1
Chemistry; metallurgy

WAFER LEVEL UNIFORMITY CONTROL IN REMOTE PLASMA FILM DEPOSITION

#13 | 2023-07-13
US20230223238A1
Electricity

INCREASING PLASMA UNIFORMITY IN A RECEPTACLE

#14 | 2023-06-08
US20230175134A1
Chemistry; metallurgy

Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition

#15 | 2022-09-08
US20220282380A1
Chemistry; metallurgy

PEDESTAL SETUP USING CAMERA WAFER

InventorID:

5511538 ⎘