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Inventor profile of:

Teemu VASARA

City:

Espoo

Country:

Finland

Published Applications:

1

Last publication date:

2022-09-15

Top Assignees for applications by Teemu VASARA

The entities that hold a legal rights for patent applications filed by inventor VASARA Teemu:

Murata Manufacturing Co., Ltd. 1 Nagaokakyo, Japan

Recent patent applications by VASARA Teemu

Teemu VASARA from Espoo, FI has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-09-15

US20220289567A1

Performing operations; transporting

Method for bonding wafers, and a wafer

InventorID:

5517154 ⎘