Brian Klopf

City:

Chicago, Illinois

Country:

United States

Published Applications:

Last publication date:

2025-05-15

Top Assignees for applications by Brian Klopf

The entities that hold a legal rights for patent applications filed by inventor Klopf Brian:

Brian Klopf from Chicago, US has applied for patents for these inventions. The list has both pending applications and granted patents:

COLLOIDAL FOOD PRODUCTS COMPRISING FILAMENTOUS FUNGAL PARTICLES

Food products comprising filamentous fungal material

Food products comprising filamentous fungal material

Food products comprising filamentous fungal material

InventorID:

5522045 ⎘