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Inventor profile of:

Daniel Modulevsky

City:

Ottawa

Country:

Canada

Published Applications:

1

Last publication date:

2022-09-22

Recent patent applications by Modulevsky Daniel

Daniel Modulevsky from Ottawa, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-09-22

US20220296777A1

Human necessities

HIGH-DENSITY MICROCHANNELS

InventorID:

5522826 ⎘