Zhuhai
China
49
2023-05-04
The entities that hold a legal rights for patent applications filed by inventor HURWITZ DROR:
DROR HURWITZ from Zhuhai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
FBAR Filter with Trap Rich Layer
#2 | 2023-03-23Film Bulk Acoustic Wave Resonator with Bifurcated Electrode
#3 | 2021-09-23PACKAGED ELECTRONIC COMPONENTS
#4 | 2021-01-28Packages with organic back ends for electronic components
#5 | 2021-01-28Packaged electronic components
#6 | 2021-01-28Method for packaging an electronic component in a package with an organic back end
#7 | 2020-10-06Method of fabricating novel packages for electronic components
#8 | 2019-08-08Single crystal piezoelectric RF resonators and filters with improved cavity definition
#9 | 2019-08-08Method for fabricating single crystal piezoelectric RF resonators and filters with improved cavity definition
#10 | 2018-12-20Multilayer electronic structures with embedded filters
#11 | 2018-09-27RF resonators and filters
#12 | 2018-09-27RF resonators and filters
#13 | 2018-09-27RF resonator electrode and membrane combinations and method of fabrication
#14 | 2018-09-27Single crystal piezoelectric RF resonators and filters
#15 | 2018-09-27Method for fabricating RF resonators and filters
#16 | 2018-09-27Method for fabricating RF resonators and filters
#17 | 2018-09-27Method of fabrication for single crystal piezoelectric RF resonators and filters
#18 | 2018-09-27RF resonator membranes and methods of construction
#19 | 2017-12-28Substrates with ultra fine pitch flip chip bumps
#20 | 2017-07-27Embedded packages
#21 | 2017-05-04Interposer frame with polymer matrix and methods of fabrication
#22 | 2017-04-27Terminations
#23 | 2017-01-05Chip package
#24 | 2017-01-05Chip package
#25 | 2016-07-07Film bulk acoustic resonator filter
#26 | 2016-07-07METHOD FOR FABRICATING FILM BULK ACOUSTIC RESONATOR FILTERS
#27 | 2016-06-09Method of fabricating a polymer frame with a rectangular array of cavities
#28 | 2016-03-17MULTILAYER ELECTRONIC STRUCTURE WITH INTEGRAL FARADAY SHIELDING
#29 | 2015-10-15INTERPOSER FRAME WITH POLYMER MATRIX AND METHODS OF FABRICATION
#30 | 2015-10-15Method for fabricating embedded chips
#31 | 2015-10-01EMBEDDED CHIPS
#32 | 2015-08-13Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor
#33 | 2015-07-30Composite electronic structure with partially exposed and protruding copper termination posts
#34 | 2015-07-09Substrates With Ultra Fine Pitch Flip Chip Bumps
#35 | 2015-02-12Thin film capacitors embedded in polymer dielectric
#36 | 2015-02-12Multilayer electronic structures with embedded filters
#37 | 2014-12-25Single layer coreless substrate
#38 | 2014-12-11Terminations and couplings between chips and substrates
#39 | 2014-06-19Single layer coreless substrate
#40 | 2014-04-17Method of fabrication, a multilayer electronic structure and structures in accordance with the method
#41 | 2014-01-23Multilayer electronic support structure with integral constructional elements
#42 | 2013-12-19Multilayer electronic structure with stepped holes
#43 | 2013-12-19Multilayer electronic support structure with cofabricated metal core
#44 | 2013-12-05MULTILAYER ELECTRONIC STRUCTURE WITH INTEGRAL FARADAY SHIELDING
#45 | 2013-12-05Multilayer electronic structure with novel transmission lines
#46 | 2013-12-05Multilayer electronic structures with vias having different dimensions
#47 | 2013-12-05Multilayer electronic structure with through thickness coaxial structures
#48 | 2013-12-05Multilayer electronic structure with integral stepped stacked structures
#49 | 2013-12-05Multilayer electronic structures with integral vias extending in in-plane direction
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