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Inventor profile of:

Yan Yang

City:

Beijng

Country:

China

Published Applications:

1

Last publication date:

2022-09-29

Recent patent applications by Yang Yan

Yan Yang from Beijng, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-09-29

US20220308288A1

METHOD FOR PACKAGING SEMICONDUCTOR STRUCTURE, PACKAGING STRUCTURE, AND CHIP

InventorID:

5532449 ⎘