Daisuke MORI

City:

Hyogo

Country:

Japan

Published Applications:

Last publication date:

2024-02-29

Top Assignees for applications by Daisuke MORI

The entities that hold a legal rights for patent applications filed by inventor MORI Daisuke:

NAGASE CHEMTEX CORPORATION 1 Osaka, Japan

Recent patent applications by MORI Daisuke

Daisuke MORI from Hyogo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-02-29

US20240071781A1

Electricity

METHOD FOR SEALING ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND HEAT-CURABLE SHEET

#2 | 2022-09-29

US20220310546A1

Electricity

MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD UNDERFILL ENCAPSULATION, ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND PRODUCTION METHOD FOR ELECTRONIC COMPONENT

InventorID:

5534223 ⎘