Poughkeepsie, New York
United States
18
2022-01-18
The entities that hold a legal rights for patent applications filed by inventor Lombardi Thomas E.:
Thomas E. Lombardi from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Connecting a component to a substrate by adhesion to an oxidized solder surface
#2 | 2020-10-15Mitigating cracking within integrated circuit (IC) device carrier
#3 | 2019-09-26Managing thermal warpage of a laminate
#4 | 2019-09-12Method and apparatus for strain relieving surface mount attached connectors
#5 | 2018-07-26Method and apparatus for strain relieving surface mount attached connectors
#6 | 2018-04-19PREVENTING AN UNWANTED DEPOSITION OF METAL DURING a FLUX CLEAN
#7 | 2017-07-06Method and apparatus for strain relieving surface mount attached connectors
#8 | 2017-06-15Selectively soluble standoffs for chip joining
#9 | 2017-05-11Barrier structures for underfill blockout regions
#10 | 2017-04-18Method and apparatus for strain relieving surface mount attached connectors
#11 | 2016-11-10Fixture to constrain laminate and method of assembly
#12 | 2015-05-21Method for shaping a laminate substrate
#13 | 2014-07-17Fixture to constrain laminate and method of assembly
#14 | 2013-12-05Fixture for shaping a laminate substrate
#15 | 2013-12-05Method for shaping a laminate substrate
#16 | 2012-07-26Fixture to constrain laminate and method of assembly
#17 | 2012-03-22Fixture to constrain laminate and method of assembly
#18 | 2007-09-27Structure and method to improve current-carrying capabilities of C4 joints
553500 ⎘