Poughkeepsie, New York
United States
71
2025-11-13
The entities that hold a legal rights for patent applications filed by inventor Weiss Thomas:
Thomas Weiss from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:
VERIFYING ALIGNMENT OF MULTIPLE DIE ON A SUBSTRATE
#2 | 2022-01-18Connecting a component to a substrate by adhesion to an oxidized solder surface
#3 | 2021-10-14Enlarged conductive pad structures for enhanced chip bond assembly yield
#4 | 2021-09-23Personalized copper block for selective solder removal
#5 | 2021-08-05Mitigating thermal-mechanical strain and warpage of an organic laminate substrate
#6 | 2021-06-10Spacer for die-to-die communication in an integrated circuit and method for fabricating the same
#7 | 2021-04-08Alignment carrier for interconnect bridge assembly
#8 | 2021-02-25Bridge support structure
#9 | 2020-10-01Spacer for die-to-die communication in an integrated circuit
#10 | 2020-09-24Lead-free column interconnect
#11 | 2020-08-25Decoupling capacitor stiffener
#12 | 2020-07-30Precision alignment of multi-chip high density interconnects
#13 | 2020-06-04Multiple chip carrier for bridge assembly
#14 | 2020-01-09Laminated stiffener to control the warpage of electronic chip carriers
#15 | 2019-12-26Formation of terminal metallurgy on laminates and boards
#16 | 2019-12-12Carrier and integrated memory
#17 | 2019-10-10Carrier and integrated memory
#18 | 2019-10-10Carrier and integrated memory
#19 | 2019-10-10Carrier and integrated memory
#20 | 2019-09-26Managing thermal warpage of a laminate
#21 | 2019-08-29Method of forming an electronic package
#22 | 2019-05-16Electronic package with tapered pedestal
#23 | 2019-01-03Lead-free solder joining of electronic structures
#24 | 2018-05-03Tamper-respondent assemblies with trace regions of increased susceptibility to breaking
#25 | 2018-04-19Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
#26 | 2018-04-19Tamper-respondent assembly with vent structure
#27 | 2018-04-12Tamper-respondent assemblies with bond protection
#28 | 2018-04-12Tamper-respondent assemblies with bond protection
#29 | 2018-04-05Tamper-proof electronic packages formed with stressed glass
#30 | 2018-04-05Tamper-respondent assemblies with enclosure-to-board protection
#31 | 2017-11-16Tamper-proof electronic packages formed with stressed glass
#32 | 2017-06-22Tamper-respondent assemblies with enclosure-to-board protection
#33 | 2017-06-15Applying pressure to adhesive using CTE mismatch between components
#34 | 2017-06-15Selectively soluble standoffs for chip joining
#35 | 2017-06-01Tamper-respondent assembly with vent structure
#36 | 2017-05-23Tamper-respondent assemblies with enclosure-to-board protection
#37 | 2017-05-11Enclosure with inner tamper-respondent sensor(s)
#38 | 2017-04-13Micro-scrub process for fluxless micro-bump bonding
#39 | 2017-03-30Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
#40 | 2017-03-30Tamper-respondent assemblies with bond protection
#41 | 2017-03-30Enclosure with inner tamper-respondent sensor(s)
#42 | 2017-03-30Tamper-respondent assemblies with bond protection
#43 | 2017-02-21Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
#44 | 2017-01-31Applying pressure to adhesive using CTE mismatch between components
#45 | 2017-01-24Tamper-respondent assemblies with enclosure-to-board protection
#46 | 2016-10-13Liquid cooled compliant heat sink and related method
#47 | 2016-03-03Liquid cooled compliant heat sink and related method
#48 | 2015-12-24Universal clamping fixture to maintain laminate flatness during chip join
#49 | 2015-12-24Universal clamping fixture to maintain laminate flatness during chip join
#50 | 2015-05-21Method for shaping a laminate substrate
#51 | 2015-04-02Electronic module assembly with patterned adhesive array
#52 | 2015-03-19Multichip module with stiffening frame and associated covers
#53 | 2015-01-27Maintaining laminate flatness using magnetic retention during chip joining
#54 | 2015-01-15Electronic module assembly with patterned adhesive array
#55 | 2015-01-01Multichip module with stiffening frame and associated covers
#56 | 2014-08-28UNIVERSAL CLAMPING FIXTURE TO MAINTAIN LAMINATE FLATNESS DURING CHIP JOIN
#57 | 2014-08-14Fill head interface with combination vacuum pressure chamber
#58 | 2013-12-05Fixture for shaping a laminate substrate
#59 | 2013-12-05Method for shaping a laminate substrate
#60 | 2010-08-12LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD
#61 | 2010-04-08Dispensing assembly with an injector controlled gas environment
#62 | 2010-04-08Dispensing assembly with a controlled gas environment
#63 | 2009-10-01METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD
#64 | 2009-01-08Greensheet via repair/fill tool
#65 | 2008-10-30Tool for filling vias in a greensheet
#66 | 2008-03-06Fully automated paste dispense system for dispensing small dots and lines
#67 | 2008-03-06Fully automated paste dispense system for dispensing small dots and lines
#68 | 2008-03-06Fully automated paste dispense system for dispensing small dots and lines
#69 | 2008-01-31Pressure-only molten metal valving apparatus and method
#70 | 2007-01-11Greensheet via repair/fill tool
#71 | 2005-02-24Fully automated paste dispense process for dispensing small dots and lines
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