Stefanie Stapf

City:

Essen

Country:

Germany

Published Applications:

Last publication date:

2025-06-19

Top Assignees for applications by Stefanie Stapf

The entities that hold a legal rights for patent applications filed by inventor Stapf Stefanie:

Henkel AG Co., KGaA 5 Duesseldorf, Germany

Recent patent applications by Stapf Stefanie

Stefanie Stapf from Essen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-06-19

US20250197691A1

Chemistry; metallurgy

DEBONDABLE SOLVENT-BORNE PRESSURE SENSITIVE ADHESIVE (PSA)

#2 | 2025-04-10

US20250115788A1

Chemistry; metallurgy

TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION

#3 | 2024-06-13

US20240191108A1

Chemistry; metallurgy

TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION

#4 | 2023-12-21

US20230407150A1

Chemistry; metallurgy

ONE COMPONENT (1K) CURABLE ADHESIVE COMPOSITION

#5 | 2023-02-09

US20230039626A1

Chemistry; metallurgy

Heat Separable Two-Layer Adhesive System and Process of Adhesive Debonding Using the Same

#6 | 2022-12-29

US20220411673A1

Chemistry; metallurgy

One component (1K) curable adhesive composition

#7 | 2022-12-08

US20220389289A1

Chemistry; metallurgy

TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION

#8 | 2022-10-20

US20220332991A1

Chemistry; metallurgy

TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION

#9 | 2022-10-06

US20220315813A1

Chemistry; metallurgy

TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION

InventorID:

5538218 ⎘